IEEE Workshop on Defects, Adaptive Test and Data Analysis

It’s all about the DATA. Everything we do in Test relies on data. We use data to identify our good parts, our bad parts, and our weak parts We manipulate test data to detect outliers and reliability risks. We use data to control and adjust future testing. We also use data to record the full history of wafer lots and to track baseline production changes. And of course we have to collect all that data, store it, analyze it, secure it, and syndicate it to authorized consumers.

The Organizing Committee for the DATA-2014 Workshop is soliciting papers in the area of semiconductor test data management, analysis, and syndication. Of particular interest are innovations and advancements in: application of “Big Data” analysis techniques to test data, semiconductor test data acquisition methods, data storage and retrieval, security and syndication, analysis methods including data mining, and implementation of adaptive test. Submissions from qualified data management parties outside the semiconductor industry are welcome. Preference will be given to real-world case studies.

Ideas or proposals for Embedded Tutorials, Debates, Panel Discussions and Poster style “Spot-Light” presentations describing industrial experiences or research are also invited.

Suggested Topics

Data storage and security

Analog Fault modeling and coverage

Analog effects in Digital Logic

Embedded Instrumentation (iJTAG)

Advanced Product Engineering Techniques

Product and Project Case studies

Advanced dppm reduction techniques

Dynamic test elimination based on data

Adaptive Test for Product Engineers

Data Analysis methods, including multivariate data

Fault Localization and Diagnosis

Yield Learning and Analysis

I/O Test, Tuning, and Adjustment

Analysis of Aging and Reliability

To present at the workshop, send to mailto:JLRoehr@TI.com a PDF version of an extended abstract or a full paper (Max 10 pages, double column, 11pt font size, IEEE proceeding format) by August 15, 2014. Each submission should include full name and address of each author, affiliation, telephone number, FAX and Email address. Camera-ready papers for inclusion in the digest of papers will be due on Oct 8.

Technical Program Submissions:

Jeffrey Roehr

Texas Instruments, USA.

E-mail: JLRoehr@TI.com

General Information:

Arani Sinha

Intel, USA.

E-mail: Arani.Sinha@INTEL.com

DATA-2014 is sponsored by:

Platinum Sponsors’:

Silver Sponsor: