IEEE International Workshop

on

Defects, Adaptive Test, Yield and Data Analysis

(DATA-2017)

 

Nov 2-3 2017

 

Fort Worth, TX

 

Submission Deadline: September 20, 2017

Notification of Acceptance: October 2, 2017

Camera Ready Paper (.pdf): October 16, 2017

Final Presentation Slides (.ppt): October 23, 2017

 

DATA-2017 will be held in conjunction with ITC 2017

THEME: “Data in the Product Lifecycle”

In test, we use data every day. Yield data, throughput data, statistical data, reliability data, outlier data, general production data are all in everyday use. However, data means much more than that. Advances in our industry allow data from wafer fab to be reused in studying system level test results. Field failure studies now routinely uses wafer probe data to understand root cause. Data has now become a product life cycle requirement—cradle to grave. Today access to the data has become an issue; the control and sharing of data among business partners. How to efficiently process data to extract the golden nuggets of useful information amid the gigabytes of unimportant noise remains a focus and a challenge for test professionals.

The Organizing Committee for the DATA-2017 Workshop is soliciting papers in: semiconductor test, yield analysis, product learning, and quality improvement. Of particular interest are advanced techniques and new tools for the use of data during the entire product life cycle, with special attention to how data can be used to change and alter test flows and decisions (adaptive test). Preference will be given to real-world case studies.

Ideas or proposals for Embedded Tutorials, Debates, Panel Discussions and Poster style “Spot-Light” presentations describing industrial experiences or research are also invited.

 

To present at the workshop, send to smith.wesley@siemens.com a PDF version of an extended abstract or a full paper (Max 10 pages, double column, 11pt font size, IEEE proceeding format) by September 20, 2017. Each submission should include full name and address of each author, affiliation, telephone number, FAX and Email address. Camera-ready papers for inclusion in the digest of papers will be due on October 16, 2017.

 

DATA-2017 is sponsored by:

DATA- 2016 is spon

Corporate Sponsors:

Platinum

 

Silver

Suggested Topics

Real Time Analysis Methods

Real Time Test Process Monitoring

Yield Learning and Analysis

Analog Fault Modeling and Coverage

Analog Effects in Digital Logic

Embedded Instrumentation (iJTAG)

Advanced DPPM Reduction & Reliability Improvement Techniques

Data Acquisition & Transport

Adaptive Test for Product Engineers

Data Analysis methods, Including

Multivariate Data

Fault Localization and Diagnosis

Data Storage and Security

I/O Test, Tuning, and Adjustment

Product and Project Case studies

General Information:

Jeff Roehr

Test Consultant

E-mail: JLRoehr@gmail.com

Technical Program Submissions:

Wesley Smith

Mentor, a Siemens company

E-mail: smith.wesley@siemens.com

Home

Call for Paper (pdf)

Paper Submission

ITC 2017

Final Program

Organizing/Program Committee

Registration

Hotel/Travel

Reservation

 

Previous Events

DATA-2016

DATA-2015

DATA-2014

DATA-2013

DATA-2012

DATA-2011

D3T workshop